Inside Cooler Master’s AI Cooling Portfolio
Take a closer look at how Cooler Master is approaching the cooling requirements of next-generation AI infrastructure.
Filmed at our Fremont, California office during OCP Global Summit 2026, this portfolio tour follows the complete cooling path from rack-level heat capture and coolant distribution to facility integration and system commissioning.
Explore our MGX rack-level cooling architecture, in-rack and in-row CDUs, commissioning equipment and modular air-assisted liquid cooling platform for increasingly dense AI and HPC environments.
CHAPTERS
00:00 Introduction
00:42 Rack-Level Cooling and MGX Portfolio
01:13 150 kW Liquid-to-Liquid In-Rack CDU
01:37 230 kW Liquid-to-Liquid In-Rack CDU
02:06 75 kW Liquid-to-Air In-Row CDU
02:37 Feeder Kit
03:05 Loop Charger
03:29 Vacuum Nitrogen Charging System
03:52 Air-Assisted Liquid Cooling Platform
04:22 Closing and OCP Booth A14
Visit Cooler Master at Booth A14 during OCP Global Summit 2026.
Engineering the next frontier of computing through thermal innovation.
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